DFN/QFN Framework Encapsulation Platform

High-reliability, high heat dissipation, high-density general-purpose chip interconnection and packaging integrated solution

The LQ-LeadFrame Series adopts copper alloy etched/stamped precision lead frames, compatible with both QFN (Quad Flat No-lead) and QFP (Quad Flat Package) configurations, supporting flexible designs ranging from 12×12 mm² to 40×40 mm² with 32-304 I/O. Utilizing high thermal conductivity epoxy molding compound, laser cavity opening, and half-etched exposed pad technology, it achieves <0.1 °C/W junction-to-board thermal resistance, meeting AEC-Q100 Grade 0 and MSL 1 reliability requirements. The platform-based delivery reduces traditional packaging NPI cycles from 8-10 weeks to 4-5 weeks, with a 15% cost reduction per unit, providing a rapidly mass-producible reliable solution for automotive electronics, industrial control, high-speed communication, and consumer electronics.

YCHIPWAY

Product dimensions：0.6×0.3mm ~ 12×12mm, package thickness 0.3~1.0mm, covering small-size, multi-pin standard package specifications

Product Application：Consumer electronics, power management chips, sensors, power devices, IoT modules, automotive electronics, industrial control chips

detailed introduction

Product Overview

The LQ-LeadFrame platform integrates globally leading copper alloy strip, high-speed etching/stamping, fully automatic Ni/Pd/Au electroplating, and high-precision EMC molding processes. It supports two interconnection methods: copper pillar flip-chip and gold/copper wire bonding. The platform offers standardized 0.4/0.5/0.65 mm pitch libraries, enabling direct reuse of existing PCB land patterns to reduce system-level routing complexity. Package outlines include:

QFN: Ultra-thin 0.55 mm thickness with an exposed pad, suitable for high-power SoCs, PMICs, and LED drivers.

QFP: Quad-side gull-wing pins for easy visual inspection and rework, ideal for MCUs, FPGAs, and interface bridge chips.

Applications

• Automotive Electronics: Body domain controllers, BMS, motor drives, LED headlight drivers

• Industrial Control: PLCs, servo drives, power inverters, smart sensors

• Communication & Computing: 5G small-cell RF frontends, Ethernet PHYs, SSD controllers

• Consumer Electronics: Fast-charging ICs, wireless earbud SoCs, TWS power management

Technical Features

Process Node: Compatible with 90 nm–5 nm silicon processes; die size 1×1 mm² – 12×12 mm²

Pins/Pads: 32–304 I/O, pitch 0.4/0.5/0.65 mm, pin coplanarity ≤ 50 µm

Thermal Performance: Exposed pad + high-thermal-conductivity EMC; RθJC < 0.8 °C/W, RθJB < 4 °C/W

Electrical Performance: Low-loop gold/copper wire bonding, parasitic inductance < 1 nH, signal integrity 40 Gbps+

Reliability: -55 °C~175 °C thermal cycling (1000 cycles), HAST 96 h, HTOL 1000 h; AEC-Q100 Grade 0 compliant

Green Manufacturing: Halogen-free EMC, RoHS/REACH compliant; molding thickness tolerance ±0.05 mm

Fast Delivery: Standard part numbers—4 weeks for prototyping, 8 weeks for mass production; supports custom leadframes, laser marking, and reel packaging.

DFN/QFN Framework Encapsulatio...

High-reliability, high heat dissipation, high-density general-purpose chip interconnection and packaging integrated solution

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