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DFN/QFN Framework Encapsulatio...
DFN/QFN Framework Encapsulation Platform
Product dimensions：0.6×0.3mm ~ 12×12mm, package thickne...
application field：Consumer electronics, power manageme...
LGA Carrier Board Packaging So...
LGA Carrier Board Packaging Solution
Product dimensions：3.0×3.0mm ~ 50×50mm, supporting medi...
application field：High-end processors, memory chips, a...
BGA packaging (High-Density Su...
BGA packaging (High-Density Substrate Array Grid Packaging)
Product dimensions：2.0×2.0mm ~ 60×60mm, supporting fine...
application field：CPU/GPU, FPGA, 5G communication chip...
FanoCore™ Ultra-High Density F...
FanoCore™ Ultra-High Density Fan-Out Wafer-Level Packaging Platform
Product dimensions：5.0×5.0mm ~ 80×80mm, supporting 2.5D...
application field：High-end AI computing chips, server ...
SiPlex™ System-level Heterogen...
SiPlex™ System-level Heterogeneous Integration Platform
Product dimensions：2.0×2.0mm ~ 45×45mm, support ultra-t...
application field：Wearable devices, consumer electroni...
LingChip Heterogeneous Integra...
LingChip Heterogeneous Integration Platform
Product dimensions：10×10mm ~ 100×100mm, compatible with...
application field：High-end AI computing chips, server ...